JPS599012A - 平板状情報記録担体複製金型の製造方法 - Google Patents
平板状情報記録担体複製金型の製造方法Info
- Publication number
- JPS599012A JPS599012A JP11885382A JP11885382A JPS599012A JP S599012 A JPS599012 A JP S599012A JP 11885382 A JP11885382 A JP 11885382A JP 11885382 A JP11885382 A JP 11885382A JP S599012 A JPS599012 A JP S599012A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- information recording
- master
- recording carrier
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 230000003362 replicative effect Effects 0.000 title abstract 3
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 3
- 238000005323 electroforming Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 230000010076 replication Effects 0.000 claims 2
- 239000011521 glass Substances 0.000 abstract description 21
- 239000012790 adhesive layer Substances 0.000 abstract description 16
- 230000002787 reinforcement Effects 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 9
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 125000006850 spacer group Chemical group 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
- 239000012779 reinforcing material Substances 0.000 description 19
- 238000007747 plating Methods 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- -1 polynutylene Substances 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 241000102542 Kara Species 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000012207 thread-locking agent Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11885382A JPS599012A (ja) | 1982-07-07 | 1982-07-07 | 平板状情報記録担体複製金型の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11885382A JPS599012A (ja) | 1982-07-07 | 1982-07-07 | 平板状情報記録担体複製金型の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS599012A true JPS599012A (ja) | 1984-01-18 |
| JPH0259044B2 JPH0259044B2 (en]) | 1990-12-11 |
Family
ID=14746754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11885382A Granted JPS599012A (ja) | 1982-07-07 | 1982-07-07 | 平板状情報記録担体複製金型の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS599012A (en]) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6055533A (ja) * | 1983-09-06 | 1985-03-30 | Fujitsu Ltd | 微細形状転写型の製造方法 |
| JPS62144919A (ja) * | 1985-11-25 | 1987-06-29 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | マトリツクス |
| JPS6371325A (ja) * | 1986-09-12 | 1988-03-31 | Matsushita Electric Ind Co Ltd | デイスク基板製造装置とその製造方法 |
| JPH02154520A (ja) * | 1988-12-06 | 1990-06-13 | Toshiba Corp | 半導体集積回路のリセット回路 |
| JPH0322230A (ja) * | 1989-06-20 | 1991-01-30 | Nikka Eng Kk | スタンパおよびその製造方法 |
| JPH11300829A (ja) * | 1998-04-22 | 1999-11-02 | Toyota Motor Corp | エンボス模様付き金属薄膜の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57103106A (en) * | 1980-12-16 | 1982-06-26 | Matsushita Electric Ind Co Ltd | Reproduction die for information recording carrier |
-
1982
- 1982-07-07 JP JP11885382A patent/JPS599012A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57103106A (en) * | 1980-12-16 | 1982-06-26 | Matsushita Electric Ind Co Ltd | Reproduction die for information recording carrier |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6055533A (ja) * | 1983-09-06 | 1985-03-30 | Fujitsu Ltd | 微細形状転写型の製造方法 |
| JPS62144919A (ja) * | 1985-11-25 | 1987-06-29 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | マトリツクス |
| JPS6371325A (ja) * | 1986-09-12 | 1988-03-31 | Matsushita Electric Ind Co Ltd | デイスク基板製造装置とその製造方法 |
| JPH02154520A (ja) * | 1988-12-06 | 1990-06-13 | Toshiba Corp | 半導体集積回路のリセット回路 |
| JPH0322230A (ja) * | 1989-06-20 | 1991-01-30 | Nikka Eng Kk | スタンパおよびその製造方法 |
| JPH11300829A (ja) * | 1998-04-22 | 1999-11-02 | Toyota Motor Corp | エンボス模様付き金属薄膜の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0259044B2 (en]) | 1990-12-11 |
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